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Intel Fires New Xeon at Cloud, Mainframe Simultaneously

Intel’s new power chip aims at high-end market dominated by RISC, POWER, mainframes and OLTP; new ASICS will make it scream in hyperscale datacenters as well.   Intel did something a little different with the design of version 3 of its top-end Xeon E7 processor family: It took advantage of …

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Intel, CoreOS Aim to Make Your Datacenter as Smart as Google’s

The goal of the joint project is to build a hyperscale-Cloud architecture with automated containers and appliances. Intel has announced an effort with groundbreaking container developer CoreOS to design appliances that could make any corporate datacenter as smart as Google’s. The two companies announced a joint project Intel officials described …

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SIMD: Key to Understanding Vectorization

In the blog How Vectorization Feeds Your Need for Speed, I described vectorization–a technique that uses SIMD (Single Instruction Multiple Data) instructions provided in SSE and AVX extensions to do data operations in parallel in 128 or 256 bit registers. Now, let’s look at what those SIMD instructions are. Although …

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Intel, Oracle Make Generic Hardware Shine as Carrier-Grade NFV

Open platforms, chip-centric controls, allow virtual servers to precisely mimic performance of high-end WAN hardware. Intel and Oracle have taken a step beyond providing the hardware for software-based carrier-quality networking to demonstrate the real thing, using open-source software, but relying on hardware a little beefier than is usually specified for …

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Intel Packs Big Power of 14nm Xeon into Tiny SoC

The newly unveiled Xeon D product family comes with 4- or 8-cores, but the offerings are designed for specific power/power use pain points. Intel has release the first system-on-a-chip (SoC) based on Xeon processors, combining I/O, networking and storage on 14nm processor base designed for high performance, low-cost and low-power …

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Intel, Oracle Roll Out High-End Converged Infrastructure for NFV

The newly unveiled rackmount carrier hardware that supports network function virtualization can also serve as muscular datacenter gear. Oracle has joined the rush to the telecom HPC market being led by Intel and open-source organizations working on technology to create software-defined networks in sophisticated, high-capacity networks covering nations rather than …

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New Wonder Material Beats Graphene in Speeding Electronics

University of Minnesota researchers say a two-dimensional material, called Black Phosphorus, could one day make consumer electronics faster than ever. Phosphorus is a highly reactive material that is found in match heads, tracer bullets and fertilizers, but it can be turned into a stable crystalline form known as black phosphorus. …

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Free eBook Shows You How to Get More From Your HPC Apps

Whether you’re a parallel computing and HPC pro or just starting out, there is something for you in the book “Optimizing HPC Applications with Intel Cluster Tools,” just published by Apress. The book’s easy, readable style belies the wealth of information in its pages, in particular a focus on how …

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Future Arrives with Robots, Spider Dresses, Intelligence Everywhere

Ultra-small cameras, microcontrollers, processors add robot-like abilities to everyday objects, Pong-like interactivity to real robots are all included in Intel’s vision of the future. And the future has arrived. It’s probably safe to say that very few people see the future arrive wrapped in a chitinous, 3D-printed skeleton dress topped …

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Xeon Phi Powerful Ally to Flu Virus Researchers

Researchers from the Amaro Lab at UC San Diego are modeling the Influenza virus using the Stampede supercomputer at the Texas Advanced Computing Center (TACC). By using Stampede, Amaro Lab’s principal investigator Rommie Amaro and post doctorate Jacob Durrant recently told the TACC Web site that they hope to better …

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